NEWS
As global leaders in fiber optic interconnect solutions, Molex, Rosenberger, and Sumitomo Electric serve hyperscale data centers, telecom infrastructure, automotive networks, and high-speed industrial applications.
With the rapid adoption of high-density MMC and MPO/MTP ferrules (16/24/32/48/64/72 fibers), these manufacturers face increasing challenges in:
Fiber height consistency
Core dip control
End-face geometry stability
High-volume, repeatable production
Cost and supply-chain reliability of consumables
To address these challenges, production teams evaluated alternative lapping film systems capable of matching or exceeding the performance of traditional solutions from 3M, SEIKOH GIKEN, ÅngströmLap, and MIPOX.

Across multiple production lines, the manufacturers encountered similar technical and operational issues:
Inconsistent fiber height during MMC pre-polishing
Core dip variability affecting insertion loss and return loss
High consumable costs from branded flocked films
Process sensitivity when scaling to 64- and 72-fiber ferrules
Limited flexibility in polishing sequence optimization
A stable, drop-in lapping film solution was required—one that could integrate into existing DI water polishing processes without equipment changes.
After qualification trials, the following XYT lapping film sequence was adopted for MMC and MPO/MTP ferrule polishing:
SC15D – 15 µm Silicon Carbide
Coarse pre-polishing
Rapid fiber leveling and bulk material removal
SC3D – 3 µm Silicon Carbide
Fine pre-polishing
Scratch refinement and surface uniformity
SC1A – 1 µm Silicon Carbide
Precision fiber height and core dip control
Critical preparation before final polish
CE0.5B – 0.5 µm Cerium Oxide
Final polishing
Optical-grade surface finish
This sequence was validated as a qualified alternative to AO, SiO₂, and CeO₂ flocked films from established suppliers.
Improved fiber height consistency across all ferrule counts
Reduced core dip variation, especially on ≥48-fiber MMC ferrules
Cleaner, more uniform end-face finish
Stable polishing behavior across extended production runs
Higher yield rates with fewer rejected connectors
No changes required to existing polishing equipment
Compatible with standard DI water polishing
Longer usable film life compared to traditional flocked films
Lower overall consumable cost per connector
MMC ferrules: 16 / 24 / 32 / 48 / 64 / 72 fibers
MPO / MTP connectors
Telecom & data center interconnects
Automotive optical networks
High-speed optical modules
Process consistency at high fiber counts
Reliable replacement for 3M, SEIKOH GIKEN, ÅngströmLap, and MIPOX
Strong control over fiber height and geometry
Flexible formats: sheets, discs, PSA, and OEM customization
Responsive technical support during qualification and ramp-up
Through structured qualification and production validation, Molex, Rosenberger, and Sumitomo Electric successfully implemented XYT SC15D, SC3D, SC1A, and CE0.5B lapping films as part of their advanced MMC and MPO/MTP ferrule polishing processes.
The result was a stable, scalable, and cost-effective polishing solution that meets the demanding requirements of modern high-density fiber optic manufacturing—without compromising optical performance or production efficiency.
XYT specializes in high-precision lapping films and polishing solutions for fiber optics, electronics, automotive, and advanced materials industries. Our products are engineered to deliver consistent results, high yield, and reliable performance across global manufacturing environments.
? Contact XYT for sample requests, cross-reference data, or process optimization support.
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