NEWS
Cerium oxide (CeO₂) stands apart in the world of abrasives due to its unique chemical-mechanical polishing (CMP) mechanism. Unlike conventional abrasives that rely solely on mechanical abrasion, cerium oxide particles interact chemically with silica-based surfaces at the atomic level. When combined with water, CeO₂ forms a hydrated surface layer that softens the substrate material, allowing for material removal rates of 0.1-0.5 μm/min with surface roughness achieving <0.01 μm Ra (Grade 14). This dual-action makes it indispensable for optical components, semiconductor wafers, and precision metal finishing.
At 8000-12000 mesh fineness, cerium oxide particles exhibit:
A leading camera manufacturer reduced polishing time by 40% after switching to XYT's cerium oxide slurry paired with the XYT-XD Mirror Polishing Machine, achieving:
When benchmarked against common abrasives:
XYT's patented cerium oxide formulations deliver:
The XYT-XD Mirror Polishing Machine enhances cerium oxide performance through:
This combination achieves surface finishes meeting ISO 10110-5 and DIN 3140 standards for optical components.
While cerium oxide costs $50-80/kg compared to $15-30/kg for aluminum oxide, its benefits include:
A: Optimal performance occurs at 20-25°C. Every 5°C increase accelerates chemical reactivity by 15% but may reduce surface uniformity.
A: For tungsten carbide and chrome-plated surfaces, we recommend combining cerium oxide with diamond abrasive in a two-step process using our XYT-XD Mirror Polishing Machine.
With 12,000㎡ production facilities and Class-1000 cleanrooms, XYT delivers:
Contact our engineers to optimize your polishing process with cerium oxide solutions tailored to your requirements.
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