Here’s a clear, technical, long-form guide suitable for semiconductor labs, materials science, failure analysis, and precision polishing documentation. It’s written in a neutral, authoritative tone and can be used as a technical article, application note, or product page.

Diamond Lapping Film Grit Progression Guide

30, 15, 12, 9, 6, 3, 1 & 0.5 Micron Diamond Lapping Film Sheets

(Flat Lay on White Background – Close-Up Reference)

Overview

Diamond Lapping Film is a precision abrasive medium engineered for controlled material removal in advanced sample preparation and microfabrication processes. Each film sheet consists of precision-graded diamond particles, uniformly resin-bonded to a flat Mylar (PET) backing, delivering exceptional flatness, predictable cutting rates, and consistent surface finishes across a wide range of materials.

When arranged in a flat lay on a white background at close-up, these films visually demonstrate their defining characteristics: uniform abrasive distribution, smooth backing consistency, and micron-specific identification—critical for repeatable, stepwise polishing workflows.

Construction and Material Science

Abrasive System

• Abrasive type: Monocrystalline diamond

• Grit range: 30 µm → 0.5 µm

• Particle grading: Tight micron tolerances to ensure uniform scratch depth

Bonding & Backing

• Bond: Resin-bonded abrasive layer for controlled exposure and particle retention

• Backing: High-uniformity Mylar (PET) film

• Thickness stability: Maintains coplanarity under wet polishing conditions

This construction enables uniform removal across heterogeneous materials, even when significant differences in hardness or modulus are present within the same sample.

Key Performance Characteristics

• Excellent edge retention
  Minimizes edge roll-off and rounding during thinning and cross-sectioning.

• Coplanarity preservation
  Maintains flatness across multilayer or composite samples.

• Predictable material removal
  Each grit delivers a controlled, repeatable removal rate.

• Low subsurface damage
  Progressive grit sequencing reduces mechanical stress and microcracking.

• Clean, slurry-free operation
  Ideal for laboratory and cleanroom environments.

Grit-by-Grit Technical Function Guide

30 Micron Diamond Lapping Film

Function: Aggressive stock removal
Primary Use:

• Rapid thickness reduction

• Initial backside material removal

• Rough planarization of hard substrates

Used at the earliest stage where geometry correction and bulk removal are required.

15 Micron Diamond Lapping Film

Function: Intermediate bulk removal
Primary Use:

• Transition from coarse grinding to controlled lapping

• Flattening warped or uneven samples

Reduces deep scratches left by 30 µm while maintaining efficient removal.

12 Micron Diamond Lapping Film

Function: Controlled coarse lapping
Primary Use:

• Precision thinning

• Surface leveling prior to fine geometry control

Often selected when finer control than 15 µm is required, especially for brittle materials.

9 Micron Diamond Lapping Film

Function: Geometry refinement
Primary Use:

• Unencapsulated cross-sectioning

• Backside polishing before fine thinning

This grit marks the transition from bulk shaping to precision surface control.

6 Micron Diamond Lapping Film

Function: Fine lapping
Primary Use:

• Scratch depth reduction

• Preparation for TEM wedge or plan-view processes

Critical for minimizing subsurface damage before ultra-fine polishing steps.

3 Micron Diamond Lapping Film

Function: Pre-finish polishing
Primary Use:

• Final geometry definition

• Surface smoothing prior to fine thinning

Frequently used before FIB preparation to reduce ion milling time.

1 Micron Diamond Lapping Film

Function: Fine polishing
Primary Use:

• TEM wedge and plan-view polishing

• Backside thinning with tight thickness control

Delivers smooth, flat surfaces while preserving edges and interfaces.

0.5 Micron Diamond Lapping Film

Function: Ultra-fine polishing
Primary Use:

• Final surface preparation before FIB

• Minimizing surface damage and roughness

Often the last mechanical step before ion beam or chemical-mechanical finishing.

Typical Application Workflows

Unencapsulated Cross-Sectioning

• Progressive lapping prevents layer delamination

• Maintains sharp material interfaces

• Supports accurate failure analysis

TEM Wedge & Plan-View Polishing

• Produces thin, uniform electron-transparent regions

• Minimizes curtaining and polishing artifacts

Backside Polishing

• Enables precise wafer thinning

• Preserves planarity for subsequent processing

FIB Sample Thinning (Pre-FIB)

• Reduces FIB milling time

• Improves surface quality and imaging stability

• Enhances final analytical accuracy

Recommended Grit Progression Example

Skipping grit sizes is not recommended, as it increases subsurface damage and polishing time.

Best Practice Guidelines

• Mount films on glass, ceramic, or precision metal plates

• Use DI water or approved lubricant

• Apply low, uniform pressure

• Clean sample and surface between grit changes

• Replace film once abrasive efficiency declines

Conclusion

30 to 0.5 Micron Diamond Lapping Film sheets form a complete, precision-controlled polishing system for advanced materials preparation. Their ability to deliver consistent edge retention, coplanarity, and predictable removal across varying material hardness makes them indispensable for semiconductor analysis, microscopy, and microfabrication workflows.