NEWS
Cerium oxide (CeO₂) has become the gold standard for precision polishing due to its unique chemical-mechanical action. Unlike conventional abrasives, cerium oxide particles exhibit a self-sharpening characteristic where fractured particles reveal fresh cutting edges during the polishing process. This property makes it exceptionally effective for achieving sub-nanometer surface roughness on materials like:
XYT's proprietary grading technology ensures cerium oxide particles maintain:
Modern automated systems integrate XYT's cerium oxide abrasives with 6-axis robots for:
Our patented DAP method combines rotational and orbital motion to eliminate directional scratch patterns, achieving Ra values below 0.5nm on BK7 glass.
XYT's cerium oxide solutions meet Telcordia GR-326-CORE standards for:
XYT's cerium oxide products undergo:
A leading optical manufacturer reduced polishing time by 40% after switching to XYT's cerium oxide system, achieving:
With 12,000㎡ of advanced manufacturing space and Class 1000 cleanrooms, XYT delivers:
Contact our abrasives specialists today to discuss your project requirements or request samples of our Lapping Film Discs for Fiber Optic Connector Polishing.
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