Lapping Film Selector Tables
Below are clean, buyer-ready Lapping Film SELECTOR TABLES designed for help customers quickly choose the right abrasive type, micron size, and backing based on application, material, and finish target.
Product Selector Table 1: Abrasive Type by Application
| Application | Recommended Abrasive | Why It’s Best |
|---|
| Fiber optic connectors (PC / UPC / APC) | Diamond → SiO₂ | Diamond controls geometry; SiO₂ delivers lowest Ra & back reflection |
| Optical glass & lenses | CeO₂ → SiO₂ | CeO₂ enhances reflectivity; SiO₂ removes haze |
| Carbide & ceramics | Diamond | Only abrasive hard enough |
| Hardened steel & super alloys | Diamond | Fast cutting, flat finish |
| Tool sharpening (chisels, plane irons) | AO → Diamond | Cost-effective sharpening + mirror finish |
| Knives & precision blades | SiC → AO → Diamond | Fast shaping → refined edge |
| Plastics & composites | SiC | Sharp cutting without loading |
| Semiconductor wafers | SiO₂ | Ultra-low defectivity |
Product Selector Table 2: Abrasive Type Comparison (Buyer View)
| Abrasive | Cutting Speed | Final Finish Quality | Typical Use Stage | Cost Level |
|---|
| SiC | Very Fast | Fair | Stock removal | Medium |
| Aluminum Oxide | Medium | Good | General polishing | Low |
| Diamond | Very Fast | Excellent | Precision lapping | High |
| Cerium Oxide | Slow | Optical-grade | Optical polish | Medium |
| Silicon Dioxide | Very Slow | Ultra-smooth | Final refinement | Low–Medium |
Product Selector Table 3: Micron Size Selection by Target Ra
| Target Surface Roughness (Ra) | Recommended Micron Size | Best Abrasive |
|---|
| >0.5 µm | 45–60 µm | SiC / Diamond |
| 0.5–0.2 µm | 15–30 µm | SiC / AO / Diamond |
| 0.2–0.1 µm | 6–9 µm | AO / Diamond |
| 0.1–0.03 µm | 1–3 µm | SiC / AO / Diamond |
| 0.03–0.01 µm | 0.5–1 µm | SiC / AO / Diamond / CeO₂ |
| <0.01 µm | 0.01–0.5 µm | SiO₂ |
Product Selector Table 4: Recommended Polishing Sequences
Fiber Optics (Fastest to Lowest Ra)
| Step | Abrasive | Micron |
|---|
| 1 | Diamond/SiC | 30/15 µm |
| 2 | Diamond/SiC | 9/6/3 µm |
| 3 | Dia/Alu/SiC/CeO₂ | 0.5–1 µm |
| 4 | SiO₂ | 0.01–0.5 µm |
Tool Sharpening / Scary Sharp System
| Step | Abrasive | Micron |
|---|
| 1 | SiC | 30–45 µm |
| 2 | Aluminum Oxide | 9–15 µm |
| 3 | Aluminum Oxide | 3 µm |
| 4 | Diamond | 1–0.5 µm |
Optical Glass Polishing
| Step | Abrasive | Micron |
|---|
| 1 | Diamond | 6–3 µm |
| 2 | Diamond | 1 µm |
| 3 | Cerium Oxide | 0.5–1 µm |
| 4 | Silicon Dioxide | 0.01–0.5 µm |
Product Selector Table 5: Backing & Format Selection
| Requirement | Recommended Option |
|---|
| Highest flatness | PSA-backed film |
| Manual sharpening | Plain-back sheets |
| Wet polishing | Polyester (PET) backing |
| Machine lapping | Discs or rolls |
| Reusable mounting | Plain-back + spray adhesive |
Quick Buyer Decision Guide
Need speed? → SiC or Diamond
Need lowest Ra? → Diamond → SiO₂
Need optical clarity? → CeO₂ → SiO₂
Need low cost? → Aluminum Oxide
Need ultra-flat precision? → PSA Diamond Film