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This standard operating procedure is based on real polishing steps documented in industry sources for MTP/MPO ferrules (e.g., 12F, 16F, 24F, 32F and higher density). It reflects common film/slurry sequences, materials, and process considerations used in production lines. Lapping Film+1

Provide a controlled, repeatable process for polishing MTP/MPO connectors to achieve:
Precise fiber height and radius control
Low insertion loss (IL) and high return loss (RL)
Mirror‑finish endfaces free of scratches or pits
Connector types covered: MTP-12, MTP-16, MTP-24, MTP-32 and higher density (UPC and APC variants). Lapping Film

Polishing films & slurries
Silicon Carbide (SiC) film/slurry
Diamond lapping film
Aluminum Oxide (Al₂O₃) film/slurry
Silicon Dioxide (SiO₂) or Cerium Oxide (CeO₂) sub‑micron finishes
(All used in multi‑step sequences documented for MTP/MPO ferrule polishing) Lapping Film+1
Polishing pads
Glass, ceramic, or precision hard platens
Pads chosen to match polishing film/slurry and connector type Lapping Film
Fluid
DI water or DI water + polishing slurry
IPA (isopropyl alcohol) for cleaning between steps
Inspection
Fiber inspection microscope
Interferometer for geometry, radius, fiber height
IL/RL test set
✔ Use lint‑free wipes
✔ Rinse and dry after every step
✔ Avoid cross‑contamination between grits
✔ Use fresh films/slurry — do not reuse across steps Lapping Film
Goal: Remove epoxy flash/uneven surface; set baseline geometry
Goal: Define radius, fiber height uniformity
Goal: Remove coarse scratches and prepare for final finish
Goal: Achieve mirror finish, low micro‑scratches
Pressure: Moderate, consistent, avoid heavy pressure
Lubrication: DI water or appropriate slurry fluid
Motion: Orbital or figure‑8 on flat platen
Inspection between steps: Microscopy + cleaning
Post‑polish test: IL/RL with optical test set
Inspect after each step
✔ No deep scratches or pits
✔ Uniform fiber height (within hundreds of nm)
✔ Controlled radius and apex offset
✔ Final IL/RL meets connector specification
Rework guidance
Scratches remain: Repeat previous grit or step up grit as needed
Geometry issue: Adjust dwell time or return to earlier grit stage
Contamination: Clean thoroughly and resume correct grit progression
🔹 Always use fresh films and slurries for each production run.
🔹 Thorough cleaning between every stage is essential to avoid cross‑contamination.
🔹 Monitor fiber height and geometry with reliable instruments.
🔹 For APC connectors, set and verify angle at the epoxy removal stage. Lapping Film
Typical sequence for high‑performance MTP/MPO ferrules (12F–32F):
SiC / Diamond – 15–30 µm → epoxy removal
SiC / Diamond – 9–3 µm → geometry & fiber height
SiC / Diamond / Al₂O₃ – 1 µm → pre‑polish
SiO₂ or CeO₂ – sub‑µm → final optical finish Lapping Film+1
✔ MTP/MPO polishing is a multi‑stage, diminishing grit process.
✔ Start with aggressive removal, finish with precision sub‑micron polishing.
✔ Cleaning and fresh consumables are essential for top performance.
✔ Final finish quality directly impacts IL and RL.
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