XYT™ Lapping Films – Technical Data Sheets

Comprehensive Overview of XYT Precision Polishing Films
(For Fiber Optics · Electronics · Metallography · Semiconductors · Precision Engineering)

4. Silicon Dioxide (SiO₂) Lapping Film Series (0.02–3 µm)

Abrasive: Silicon Dioxide | Backing: PET | Form: Sheet · Disc · Roll

Description:
Ultra-fine polishing films for final finishing of fiber connectors and ferrules. Achieves superior surface smoothness and high return loss. Designed for use with DI water only to prevent chemical residues.

Applications:

Final polish step for MT, TMT, and ceramic ferrules
High-performance MPO/MTP connector finishing
Precision glass or optical component polishing

Micron Range: 0.02 µm – 3 µm
Compliance: RoHS / REACH Certified

6. Specialty & Custom Films

Foam-Backed Films: For improved surface conformity
Structured Abrasive Films: For consistent micro-removal
Customized Rolls/Discs: 3"–16" diameters or OEM-labeled rolls

Typical Product Forms

Form	Dimensions	Use
Sheets	6'' x 6'', 8'' x 8'', 8.5'' x 11'', 9″ × 11″ Custom	Manual or fixture-based polishing
Discs	1″ – 16″ dia.	Machine lapping and turntable systems
Rolls	Custom lengths	Continuous process lines

Performance Summary

Film Type	Material Removal	Surface Finish (Ra)	Application Stage
Diamond	★★★★★	< 0.01 µm	Coarse–Fine
Aluminium Oxide	★★★★☆	< 0.02 µm	Mid–Fine
Silicon Carbide	★★★☆☆	< 0.05 µm	Pre-finish
Silicon Dioxide	★★★★★	< 0.005 µm	Final
Cerium Oxide	★★★★★	< 0.005 µm	Final